Metal Etching Device [Copper] Sheet Type | NSC Engineering
High-precision etching of a wide range of products from thin plates to thick plates is possible! Quality is determined by optimal spraying conditions.
The copper plates that have been pattern-turned are transported horizontally while lying flat, and the etching solution is sprayed onto them, enabling copper etching processing for both thin and thick plates. 【Features of Our Equipment】 ■ Etching shapes on both sides are equivalent ■ Gloss finish on the etching cross-section is possible ■ Low cost due to liquid management and liquid regeneration system ■ Capable of transporting materials with a thickness of 50μm due to the latest technology ■ Designed with a focus on chemical resistance for long-lasting equipment ■ Complete safety interlock system ◇◆◇◆◇◆◇◆◇◆◇◆◇◆◇◆ Example of Processing 【Product】2mm thick copper 【Dimensional Accuracy】 ・L/S=3/2mm ・Taper width during single-side etching is approximately 0.5mm ・Taper width during double-side etching is approximately 0.25mm 【Main Chemical】Ferric chloride ◇◆◇◆◇◆◇◆◇◆◇◆◇◆◇◆ 【Notes】 ・Proposal, design, and manufacturing are possible from the development prototype
- Company:NSC エンジニアリング本部
- Price:Other