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Metal Etching Device [Copper] Sheet Type | NSC Engineering
High-precision etching of a wide range of products from thin plates to thick plates is possible! Quality is determined by optimal spraying conditions.
The copper plates that have been patterned are transported horizontally while lying flat, and the etching solution is sprayed onto them, enabling copper etching processing for both thin and thick plates. 【Features of Our Equipment】 ■ Etching shapes on both sides are equivalent ■ Glossing of the etching cross-section is possible ■ Low cost due to liquid management and liquid regeneration systems ■ Capable of transporting materials with a thickness of 50μm thanks to the latest technology ■ Designed with a focus on chemical resistance for long-lasting equipment ■ Complete with safety interlocks ◇◆◇◆◇◆◇◆◇◆◇◆◇◆◇◆ Example of Processing 【Product】2mm thick copper 【Dimensional Accuracy】 ・L/S=3/2mm ・Taper width during single-sided etching approximately 0.5mm ・Taper width during double-sided etching approximately 0.25mm 【Main Chemical】Ferric chloride ◇◆◇◆◇◆◇◆◇◆◇◆◇◆◇◆ 【Notes】 ・Proposal, design, and manufacturing from development prototypes are possible ・Sample processing using actual liquid is possible
- Company：NSC エンジニアリング本部
- Price：Other
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